34th Annual IEEE Computer Software and Applications Conference

Program Committee

General Chairs


Bruce McMillin

Missouri University of Science & Technology, USA
Email: ff at mst.edu

Klaus Beetz
Siemens AG, Germany
Email: klaus.beetz at siemens.com


Program Chairs


Sheikh Iqbal Ahamed
Marquette University, USA
Email: sheikh.ahamed at marquette.edu


Wolfgang Minker
University of Ulm, Germany
Email: worlfgang.minker at uni-ulm.de

Zhi Jin
Peking University, China
Email: zhijin at amss.ac.cn


Program Committee

Gail-Joon Ahn,Arizona State University, USA
Jalal Al-Muhtadi, King Saud University, Saudi Arabia
Jan Alexandersson, DFKI, Germany
Andrea Ahlemeyer-Stubbe, Stubbe antz21, Germany
Jose Miguel Alonso, University of the Basque Country, Spain
Mikio Aoyama,Nanzan University, Japan
Masahiro Araki, Kyoto Institute of Technology, Japan
Doo-Hwan Bae,KAIST, Korea
Xiaoying Bai,Tsinghua University, China
Saleh Mohammed Saleh Basalamah, Umm Al-Qura University, Saudi Arabia
Paolo Bellavista, DEIS, University of Bologna, Italy
Fevzi Belli,University of Paderborn, Germany
Elisa Bertino,Purdue University, USA
Maarten Boasson,University of Amsterdam, The Netherlands
Dennis Brylow,Marquette University, USA
Christof Budnik, Siemens, USA
Kai-Yuan Cai, Beijing University of Aeronautics and Astronautics, China
Ying Cai,Iowa State University, USA
Roy Campbell, University of Illinois at Urbana-Champaign, USA
Joao W. Cangussu,Microsoft, USA
Zoraida Callejas Carrion, University of Granada, Spain
W.K. Chan,City University of Hong Kong
Carl K. Chang,Iowa State University, USA
Y. C. Chen,National Chiao Tung University, Taiwan
Shing-Chi Cheung, Hong Kong University of Sci. and Tech., Hong Kong
Maurice Chu, PARC Ubiquitous Computing, USA
William Chu ,Tunghai University, Taiwan
Bill Claycomb, Sandia National Laboratory, USA
Ivica Crnkovic,Malardalen University, Sweden
James Cross,Auburn University, USA
Alfredo Cuzzocrea,ICAR/DEIS, University of Calabria, USA
RamĂ³n LĂ³pez-CĂ³zar Delgado,Universidad de Granada, Spain
Simon Egerton, Monash University, Malaysia
Atilla Elci
, Suleyman Demirel University, Turkey
Carles Fernandez, University Autonoma of Barcelona, Spain
Vladimir Getov
,University of Westminster, UK
Chris Gill, Washington University, USA
Haishan Gong, EBay, USA
David Griol, Carlos III University of Madrid, Spain
Michael Grottke
, University of Erlangen-Nuremberg, Germany
Volker Gruhn, University Duisburg-Essen, Germany
Tobias Heinroth, Universitat Ulm, Germany
Dirk Heylen
, University of Twente, Netherlands
Leong Hong-va, Hong Kong Polytechnic University, China
Chung Horng-Lung,Carleton University, Canada
James Joshi,University of Pittsburgh, USA
Achilles Kameas, Hellenic Open University, Greece
Murat Kantarcioglu,UT Dallas, USA
Karama Kanoun, LAAS-CNRS, France
Koichi Katsurada, Toyohashi University of Technology, Japan
Lars Karg
, SAP Research, Germany
Ron Kenett, KPA Ltd., Israel
Didier Keymeulen, NASA, USA
Anatoly Khomonenko, Petersburg State Transport University, Russia
Dae-Kyoo Kim,Oakland University, USA
Kostas Kontogiannis
,University of Waterloo, Canada
John Koo,Chinese Academy of Sciences, China
Axel Kuepper,Deutsche Telekom, Germany
Dave Kung,University of Texas at Arlington, USA
Itaru Kuramoto, Kyoto Institute of Technology, Japan
Ville Leppanen
, Finland
Jenny Li,Avaya Labs, USA
Johan Lilius,Ăƒbo Akadem Unversityi, Finland
Frank Liu, Missouri University of Science and Technology, USA
Jigang Liu, Metropolitan State University, USA
Lin Liu, Tsinghua University, China
Xiaodong Liu,Napier University, UK
Jian Lu, Nanjing University, China
Hanan Lutfiyya ,University of Western Ontario, Canada
Praveen Madiraju,Marquette University, USA
Bruce McMillin, Missouri University of Science and Technology, USA
Hong Mei
, Peking University, China
Simanta Mitra,Iowa State University, USA
Sebastian Möeller, Telekom, Germany
Kazuyoshi Murata
, Kyoto Institute of Technology, Japan
Doug Niehaus
,University of Kansas, USA
Jeff Z. Pan
, The University of Aberdeen, UK
Hongyu Pei-Breivold, ABB Corporate Research, Sweden
Paul Pettersson, Malardalen University, Sweden
Daniele Quercia, University of Cambridge, UK
Aaron Quigley
, University of St. Andrews, UK
Yossi Raanan, College of Management, Rishon, Israel
Gregg Rothermel, University of Nebraska, Lincoln, USA
Juha Savolainen,Nokia, Finland
Ina Schieferdecker,Fraunhofer FOKUS, Germany
Alexander Schmitt, Universitat Ulm, Germany
Martina Schollmeyer
, BMW Munich, Germany
Cristina Seceleanu,Malardalen University, Sweden
Tiberiu Seceleanu, ABB Corporate Research, Sweden
Sahra Sedigh, Missouri University of Science and Technology, USA
Cristina Serban,AT&T, USA
Tomothy Shih, National Central University, Taiwan
Yu Shibuya, KIT, Japan
Jawed Siddiqi, Hallam University, UK
Marcus Spies, University of Munich, Germany
Pradip Srimani
,Clemson University, USA
Rajesh Subramanyan,Siemens, USA
Yasuhiro Sugiyama, Nihon University, Japan
Kenji Takahashi, NTT Multimedia Communications Lab, USA
Michiharu Takemoto,NTT Labs, Japan
Ankur Teredesai,University of Washington, USA
T.H. TSE, University of Hong Kong, China
Tugkan Tuglular, Izmir Institute of Technology, Turkey
Ronald J. Vetter
, University of North Carolina Wilmington, USA
Feng-Jian Wang, National Chiao-Tung University, Taiwan
Qianxiang Wang,Peking University, China
Eric Wong,UT Dallas, USA
Johnny Wong, Iowa State University, USA
Chunxiao Xing, Tsinghua University, China
Dianxiang Xu,Dakota State University, USA
Hongji Yang,De Montford University, UK
Y. T. Yu, City University of Hong Kong, Hong Kong
Weider Yu,San Jose State University, USA
Shi Yuanchun, Tsinghua University, China
Jian Zhang,Chinese Academy of Sciences, China
Zhenyu Zhang, Chinese Academy of Sciences, China
Hong Zhu,Oxford Brookes University, UK
Mohammad Zulkernine,Queen's University, Canada

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